TEAMGROUP T-FORCE GE PRO 2TB AirFlow I Heat Sink - PCIe Gen5 x4 NVMe
TEAMGROUP T-FORCE GE PRO 2TB AirFlow I Heat Sink TM8FG3002T0C133 adalah SSD (Solid State Drive) yang dilengkapi pendingin AirFlow I Heat Sink, dukungan DRAM, antarmuka PCIe Gen5 x4 NVMe, serta kapasitas penyimpanan sebesar 2 TB.
Dijual oleh
Yolori Mall
TEAMGROUP T-FORCE GE PRO 2TB AirFlow I Heat Sink TM8FG3002T0C133 adalah SSD (Solid State Drive) dengan ketahanan guncangan Shock: 1,500G/0.5ms. SSD (Solid State Drive) dari TEAMGROUP ini juga dibekali AirFlow I Heat Sink. Dimensinya 77.0 x 24.7 x 62.3 mm. Beratnya 7 g. SSD (Solid State Drive) dari TEAMGROUP ini juga dibekali DRAM. Daya tahan Endurance Tbw sebesar 1200 TBW. Bentuk Form Factor adalah M.2 2280. Antarmuka Interface memakai PCIe Gen5 x4 NVMe. Umur pakai Lifespan mencapai 1,700,000 Hours. Suhu operasi berada pada kisaran 0°C ~ 70°C. Konsumsi daya menggunakan DC +3.3V. Performa Read Write Performance mencapai Sequential Read: Up to 14,000 MB/s dan Sequential Write: Up to 11,800 MB/s. Kapasitas Storage Capacity sebesar 2 TB. TEAMGROUP Indonesia memberikan garansi resmi selama 60 bulan untuk produk ini.
Garansi
- Warranty Months
- 60
- Warranty Type
- TEAMGROUP Indonesia Official Warranty
Jaminan
- Stock Status
- Tersedia
Spesifikasi Teknis
- Endurance (TBW)
- 1200 TBW
- Form Factor
- M.2 2280
- Cache
- DRAM
- Lifespan
- 1,700,000 Hours
- Interface
- PCIe Gen5 x4 NVMe
- Storage Capacity
- 2 TB
- Read Write Performance
- Sequential Read:Up to 14,000 MB/s Sequential Write:Up to 11,800 MB/s
- Cooling
- AirFlow I Heat Sink
- Operating Temperature
- 0°C ~ 70°C
- Power Consumption
- DC +3.3V
- Features
- Shock:1,500G/0.5ms
- Dimensions
- 77.0 x 24.7 x 62.3 mm
- Weight
- 7 g
Bandingkan dengan produk sejenis
Pilihan lain pada kategori yang sama dengan harga berdekatan.
| Sedang dilihatTEAMGROUPTEAMGROUP T-FORCE GE PRO 2TB AirFlow I Heat Sink - PCIe Gen5 x4 NVMe |  Sedang dilihatTEAMGROUPTEAMGROUP T-FORCE G70 PRO 2TB Aluminum Heat Sink - PCIe Gen4 x4 NVMe |  Sedang dilihatTranscendTranscend MTE260S 1TB - M.2 2280, PCIe Gen5 x4 NVMe |  Sedang dilihatSamsungSamsung 990 PRO 1TB Heatsink - M.2 2280, PCIe Gen4 x4 NVMe, V-NAND TLC | |
|---|---|---|---|---|
| Harga | Rp 5.739.000 | Rp 5.719.000 | Rp 5.649.000 | Rp 5.909.000 |
| Garansi | ||||
| Warranty Months | 60 | 60 | 60 | 60 |
| Warranty Type | TEAMGROUP Indonesia Official Warranty | TEAMGROUP Indonesia Official Warranty | Transcend Indonesia Official Warranty | Samsung Indonesia Official Warranty |
| Jaminan | ||||
| Stock Status | Tersedia | Tersedia | Tersedia | Tersedia |
| Spesifikasi Teknis | ||||
| Encryption | — | — | — | AES 256-bit Encryption (Class 0), TCG/Opal, IEEE1667 (Encrypted drive) |
| Endurance (TBW) | 1200 TBW | 1480 TBW | 750 TBW | — |
| Form Factor | M.2 2280 | M.2 2280 | M.2 2280 | M.2 (2280) |
| Cache | DRAM | DRAM | DRAM | Samsung 1GB Low Power DDR4 SDRAM |
| Bundled Software | — | — | — | Magician Software for SSD management |
| Lifespan | 1,700,000 Hours | 3,000,000 Hours | Reliability (MTBF):2,000,000 hour(s) Reliability (DWPD):0.411 (5 yrs) | 1.5 Million Hours |
| Interface | PCIe Gen5 x4 NVMe | PCIe Gen4 x4 NVMe | NVMe PCIe Gen5 x4 | • PCIe Gen 4.0 x4 • NVMe 2.0 |
| Storage Capacity | 2 TB | 2 TB | 1 TB | 1 TB |
| Flash NAND | — | — | 3D NAND flash | Samsung V-NAND 3-bit MLC |
| Read Write Performance | Sequential Read:Up to 14,000 MB/s Sequential Write:Up to 11,800 MB/s | Sequential Read:Up to 7,400 MB/s Sequential Write:Up to 6,800 MB/s | Sequential Read:Up to 14,000 MB/s Sequential Write:Up to 9,800 MB/s Random Read (4K):Up to 1,600,000 IOPS Random Write (4K):Up to 1,400,000 IOPS | Sequential Read:Up to 7,450 MB/s Sequential Write:Up to 6,900 MB/s Random Read (4KB, QD32):Up to 1,200,000 IOPS Random Write (4KB, QD32):Up to 1,550,000 IOPS Random Read (4KB, QD1):Up to 22,000 IOPS Random Write (4KB, QD1):Up to 80,000 IOPS |
| Compatibility | — | Compatible with Intel and AMD platforms and has one of the following operating systems: Windows 11 / 10 / 8.1 / 8 / 7 / Vista MAC OS 10.4 or later Linux 2.6.33 or later | Microsoft Windows 7 or later, Linux Kernel 2.6.31 or later | — |
| Chipset | — | — | — | Samsung in-house Controller |
| Cooling | AirFlow I Heat Sink | Aluminum Heat Sink | Graphene heatsink | — |
| Operating Temperature | 0°C ~ 70°C | 0°C ~ 70°C | 0°C (32°F) ~ 70°C (158°F) | 0 - 70 ℃ |
| Certification | — | — | CE, UKCA, FCC, BSMI, KC, RCM | — |
| Power Consumption | DC +3.3V | DC +3.3V | 3.3V±5% | Average Power Consumption (system level): • Average: 5.4 W • Maximum: 7.8 W (Burst mode) Power consumption (Idle):Max. 50 mW Allowable Voltage:3.3 V ± 5 % |
| Features | Shock:1,500G/0.5ms | Shock:1,500G/0.5ms | S.M.A.R.T.:Yes Advanced Garbage Collection:Yes RAID Engine:Yes LDPC Coding:Yes | Application:Client PCs, Game Consoles TRIM Support:Supported S.M.A.R.T Support:Supported GC (Garbage Collection):Auto Garbage Collection Algorithm WWN Support:Not supported Device Sleep Mode Support:Yes Shock:1,500 G & 0.5 ms (Half sine) |
| Dimensions | 77.0 x 24.7 x 62.3 mm | 80.0 x 22.0 x 8.7 mm | Double-sided: 80 mm x 22 mm x 3.77 mm | 80 x 24.3 x 8.2 mm (with heatsink) |
| Weight | 7 g | 54 g | 10 g | 28.0 g |
Ulasan Pembeli
Memuat ulasan...