TEAMGROUP T-FORCE G70 PRO 2TB Aluminum Heat Sink - PCIe Gen4 x4 NVMe
TEAMGROUP T-FORCE G70 PRO 2TB Aluminum Heat Sink TM8FFH002T0C128 adalah SSD (Solid State Drive) berkapasitas 2 TB dengan antarmuka PCIe Gen4 x4 NVMe, kecepatan baca hingga 7.400 MB/s dan tulis hingga 6.800 MB/s, serta dilengkapi pendingin aluminium dan DRAM untuk performa optimal di berbagai platform.
Dijual oleh
Yolori Mall
TEAMGROUP T-FORCE G70 PRO 2TB Aluminum Heat Sink TM8FFH002T0C128 adalah SSD (Solid State Drive) dengan ketahanan guncangan Shock: 1,500G/0.5ms. SSD (Solid State Drive) dari TEAMGROUP ini juga dibekali Aluminum Heat Sink. Perangkat ini memiliki dimensi 80.0 x 22.0 x 8.7 mm dengan berat 54 g. SSD (Solid State Drive) dari TEAMGROUP ini juga dibekali DRAM. Kompatibilitasnya mencakup Compatible with Intel and AMD platforms and has one of the following operating systems: Windows 11 / 10 / 8.1 / 8 / 7 / Vista MAC OS 10.4 or later Linux 2.6.33 or later. Endurance TBW dari SSD ini adalah 1480 TBW dengan Form Factor M.2 2280 serta Interface PCIe Gen4 x4 NVMe. Lifespan perangkat mencapai 3,000,000 Hours pada suhu operasi 0°C ~ 70°C. Konsumsi dayanya menggunakan DC +3.3V, sementara Read Write Performance menawarkan Sequential Read: Up to 7,400 MB/s; Sequential Write: Up to 6,800 MB/s dengan Storage Capacity 2 TB. TEAMGROUP Indonesia memberikan garansi resmi selama 60 bulan untuk produk ini.
Garansi
- Warranty Months
- 60
- Warranty Type
- TEAMGROUP Indonesia Official Warranty
Jaminan
- Stock Status
- Tersedia
Spesifikasi Teknis
- Endurance (TBW)
- 1480 TBW
- Form Factor
- M.2 2280
- Cache
- DRAM
- Lifespan
- 3,000,000 Hours
- Interface
- PCIe Gen4 x4 NVMe
- Storage Capacity
- 2 TB
- Read Write Performance
- Sequential Read:Up to 7,400 MB/s Sequential Write:Up to 6,800 MB/s
- Compatibility
- Compatible with Intel and AMD platforms and has one of the following operating systems: Windows 11 / 10 / 8.1 / 8 / 7 / Vista MAC OS 10.4 or later Linux 2.6.33 or later
- Cooling
- Aluminum Heat Sink
- Operating Temperature
- 0°C ~ 70°C
- Power Consumption
- DC +3.3V
- Features
- Shock:1,500G/0.5ms
- Dimensions
- 80.0 x 22.0 x 8.7 mm
- Weight
- 54 g
Bandingkan dengan produk sejenis
Pilihan lain pada kategori yang sama dengan harga berdekatan.
| Sedang dilihatTEAMGROUPTEAMGROUP T-FORCE G70 PRO 2TB Aluminum Heat Sink - PCIe Gen4 x4 NVMe |  Sedang dilihatTEAMGROUPTEAMGROUP T-FORCE GE PRO 2TB AirFlow I Heat Sink - PCIe Gen5 x4 NVMe |  Sedang dilihatTranscendTranscend MTE260S 1TB - M.2 2280, PCIe Gen5 x4 NVMe |  Sedang dilihatSamsungSamsung 990 PRO 1TB Heatsink - M.2 2280, PCIe Gen4 x4 NVMe, V-NAND TLC | |
|---|---|---|---|---|
| Harga | Rp 5.719.000 | Rp 5.739.000 | Rp 5.649.000 | Rp 5.909.000 |
| Garansi | ||||
| Warranty Months | 60 | 60 | 60 | 60 |
| Warranty Type | TEAMGROUP Indonesia Official Warranty | TEAMGROUP Indonesia Official Warranty | Transcend Indonesia Official Warranty | Samsung Indonesia Official Warranty |
| Jaminan | ||||
| Stock Status | Tersedia | Tersedia | Tersedia | Tersedia |
| Spesifikasi Teknis | ||||
| Encryption | — | — | — | AES 256-bit Encryption (Class 0), TCG/Opal, IEEE1667 (Encrypted drive) |
| Endurance (TBW) | 1480 TBW | 1200 TBW | 750 TBW | — |
| Form Factor | M.2 2280 | M.2 2280 | M.2 2280 | M.2 (2280) |
| Cache | DRAM | DRAM | DRAM | Samsung 1GB Low Power DDR4 SDRAM |
| Bundled Software | — | — | — | Magician Software for SSD management |
| Lifespan | 3,000,000 Hours | 1,700,000 Hours | Reliability (MTBF):2,000,000 hour(s) Reliability (DWPD):0.411 (5 yrs) | 1.5 Million Hours |
| Interface | PCIe Gen4 x4 NVMe | PCIe Gen5 x4 NVMe | NVMe PCIe Gen5 x4 | • PCIe Gen 4.0 x4 • NVMe 2.0 |
| Storage Capacity | 2 TB | 2 TB | 1 TB | 1 TB |
| Flash NAND | — | — | 3D NAND flash | Samsung V-NAND 3-bit MLC |
| Read Write Performance | Sequential Read:Up to 7,400 MB/s Sequential Write:Up to 6,800 MB/s | Sequential Read:Up to 14,000 MB/s Sequential Write:Up to 11,800 MB/s | Sequential Read:Up to 14,000 MB/s Sequential Write:Up to 9,800 MB/s Random Read (4K):Up to 1,600,000 IOPS Random Write (4K):Up to 1,400,000 IOPS | Sequential Read:Up to 7,450 MB/s Sequential Write:Up to 6,900 MB/s Random Read (4KB, QD32):Up to 1,200,000 IOPS Random Write (4KB, QD32):Up to 1,550,000 IOPS Random Read (4KB, QD1):Up to 22,000 IOPS Random Write (4KB, QD1):Up to 80,000 IOPS |
| Compatibility | Compatible with Intel and AMD platforms and has one of the following operating systems: Windows 11 / 10 / 8.1 / 8 / 7 / Vista MAC OS 10.4 or later Linux 2.6.33 or later | — | Microsoft Windows 7 or later, Linux Kernel 2.6.31 or later | — |
| Chipset | — | — | — | Samsung in-house Controller |
| Cooling | Aluminum Heat Sink | AirFlow I Heat Sink | Graphene heatsink | — |
| Operating Temperature | 0°C ~ 70°C | 0°C ~ 70°C | 0°C (32°F) ~ 70°C (158°F) | 0 - 70 ℃ |
| Certification | — | — | CE, UKCA, FCC, BSMI, KC, RCM | — |
| Power Consumption | DC +3.3V | DC +3.3V | 3.3V±5% | Average Power Consumption (system level): • Average: 5.4 W • Maximum: 7.8 W (Burst mode) Power consumption (Idle):Max. 50 mW Allowable Voltage:3.3 V ± 5 % |
| Features | Shock:1,500G/0.5ms | Shock:1,500G/0.5ms | S.M.A.R.T.:Yes Advanced Garbage Collection:Yes RAID Engine:Yes LDPC Coding:Yes | Application:Client PCs, Game Consoles TRIM Support:Supported S.M.A.R.T Support:Supported GC (Garbage Collection):Auto Garbage Collection Algorithm WWN Support:Not supported Device Sleep Mode Support:Yes Shock:1,500 G & 0.5 ms (Half sine) |
| Dimensions | 80.0 x 22.0 x 8.7 mm | 77.0 x 24.7 x 62.3 mm | Double-sided: 80 mm x 22 mm x 3.77 mm | 80 x 24.3 x 8.2 mm (with heatsink) |
| Weight | 54 g | 7 g | 10 g | 28.0 g |
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